| US 7,463,477 B2 | ||
| Mixed dispersant, paste composition and dispersion method using the same | ||
| Seon-mi Yoon, Yongin-si (Korea, Republic of); Eun-sung Lee, Yongin-si (Korea, Republic of); Jae-young Choi, Suwon-si (Korea, Republic of); Seul-ki Kim, Yongin-si (Korea, Republic of); Jong-gab Baek, Hwaseong-si (Korea, Republic of); and Seo-ho Lee, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do (Korea, Republic of) | ||
| Filed on Dec. 28, 2005, as Appl. No. 11/318,558. | ||
| Claims priority of application No. 10-2005-0064159 (KR), filed on Jul. 15, 2005. | ||
| Prior Publication US 2007/0014074 A1, Jan. 18, 2007 | ||
| Int. Cl. H01G 4/06 (2006.01) | ||
| U.S. Cl. 361—321.1 [361/321.2; 361/321.4; 361/311; 361/313; 361/306.1] | 20 Claims |
| 1. A mixed dispersant containing:
a basic dispersant; and
an acidic dispersant in accordance with the acidity to basicity ratio at the surface of nickel metal powder,
wherein the ratio of the amounts of the basic dispersant and the acidic dispersant is about ±30 equivalent % based on the
acidity to basicity ratio at the surface of the nickel metal powder.
|