| US 7,462,244 B2 | ||
| Device and method for vacuum film formation | ||
| Koji Utsugi, Tokyo (Japan); Hironori Yamamoto, Tokyo (Japan); Mariko Miyachi, Tokyo (Japan); Tamaki Miura, Tokyo (Japan); Mitsuhiro Mori, Tokyo (Japan); Yutaka Bannai, Tokyo (Japan); and Ikiko Yamazaki, Tokyo (Japan) | ||
| Assigned to NEC Corporation, Tokyo (Japan) | ||
| Appl. No. 10/493,699 PCT Filed Nov. 21, 2002, PCT No. PCT/JP02/12210 § 371(c)(1), (2), (4) Date Apr. 27, 2004, PCT Pub. No. WO03/046246, PCT Pub. Date Jun. 05, 2003. |
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| Claims priority of application No. 2001-361709 (JP), filed on Nov. 27, 2001. | ||
| Prior Publication US 2005/0008778 A1, Jan. 13, 2005 | ||
| Int. Cl. C23C 16/54 (2006.01) | ||
| U.S. Cl. 118—718 [118/720; 118/729] | 5 Claims |
| 1. A vacuum deposition apparatus comprising:
a feed roller for feeding therefrom a substrate;
a take-up roller for winding the substrate fed by said feed roller;
plural evaporation sources that each includes a substance to be evaporated to deposit on the substrate for vacuum deposition;
plural evaporated substance supply members for guiding the evaporated substances to the substrate and being disposed between
the evaporation sources and the substrate, wherein the evaporated substance supply members have plural slit openings on a
side nearest the substrate; and
plural shutters disposed between respective said evaporated substance supply members and respective said evaporation sources
for intermittently blocking movement of the evaporated substances from said evaporation sources to the substrate.
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