| US 7,586,963 B2 | ||
| Modular diode laser assembly | ||
| Derek E. Schulte, Portland, Oreg. (US); Yu Yan, Vancouver, Wash. (US); Robert J. Martinsen, West Linn, Oreg. (US); Aaron L. Hodges, Hillsboro, Oreg. (US); and Scott R. Karlsen, Battle Ground, Wash. (US) | ||
| Assigned to nLight Photonics Corporation, Vancouver, Wash. (US) | ||
| Filed on Mar. 17, 2006, as Appl. No. 11/378,697. | ||
| Application 11/378697 is a continuation in part of application No. 11/313068, filed on Dec. 20, 2005, granted, now 7,436,868. | ||
| Claims priority of provisional application 60/739185, filed on Nov. 22, 2005. | ||
| Prior Publication US 2007/0116074 A1, May 24, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01S 3/04 (2006.01) | ||
| U.S. Cl. 372—36 [372/34] | 8 Claims |
| 8. A diode laser assembly comprising:
a stepped cooling block, said stepped cooling block comprising a first cooling block section and an adjacent second cooling
block section, wherein each of said first and second cooling block sections includes a plurality of stepped mounting surfaces
of increasing height relative to a plane corresponding to a lowermost portion of a cooling block bottom surface, wherein adjacent
stepped mounting surfaces of said first and second cooling block sections are non-coplanar with said stepped mounting surfaces
of said first cooling block section positioned lower than said adjacent stepped mounting surfaces of said second cooling block
section;
a plurality of diode laser subassemblies, wherein each of said diode laser subassemblies is comprised of:
a mounting block;
a diode laser submount mounted to said mounting block; and
a diode laser mounted to said diode laser submount;
a first beam conditioning lens mounted to said mounting block, wherein an output beam from said diode laser passes through
said first beam conditioning lens;
a second beam conditioning lens mounted to said mounting block, wherein a second output beam from a different diode laser
subassembly of said plurality of diode laser subassemblies passes through said second beam conditioning lens; and
means for mounting each of said plurality of diode laser subassemblies onto corresponding stepped mounting surfaces of said
plurality of stepped mounting surfaces of said first cooling block section of said stepped cooling block, wherein each output
beam from said plurality of diode laser subassemblies is displaced relative to an adjacent output beam.
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