| US 7,586,529 B2 | ||
| Solid-state imaging device | ||
| Katsutoshi Shimizu, Kyoto (Japan); Masanori Minamio, Takatsuki (Japan); and Kouichi Yamauchi, Takatsuki (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Filed on Oct. 21, 2004, as Appl. No. 10/969,822. | ||
| Claims priority of application No. 2003-363609 (JP), filed on Oct. 23, 2003. | ||
| Prior Publication US 2005/0088565 A1, Apr. 28, 2005 | ||
| Int. Cl. H04N 3/14 (2006.01); H01J 40/14 (2006.01); H01L 21/00 (2006.01); H04N 5/225 (2006.01) | ||
| U.S. Cl. 348—294 [250/239; 438/48; 348/340] | 35 Claims |
| 1. A solid-state imaging device, comprising:
a base formed with a resin;
frame-shaped ribs provided on the base;
a plurality of wiring members embedded in the base so as to extend from an internal space of a housing formed by the base
and the ribs to an external portion;
an imaging element fixed to the base inside the internal space;
a transparent plate fixed to an upper surface of the ribs; and
connecting members electrically connecting electrodes of the imaging element to the wiring members;
wherein a plurality of protrusions are provided on the base, and the imaging element is fixed by an adhesive to the base while
being supported by the protrusions,
each of the wiring members has a thin portion and a thick portion,
the thin portion is located below the rib so as to be recessed from a lower surface of the thick portion,
a top surface of the thick portion is connected electrically to the connecting member,
a lower surface of the thick portion is exposed from the resin of the base, and
a lower surface of the thin portion is covered with the resin of the base.
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