| US 7,586,189 B2 | ||
| Heat dissipation structure accommodated in electronic control device | ||
| Satoshi Yamauchi, Anjo (Japan); and Akihiro Mizutani, Nagoya (Japan) | ||
| Assigned to Denso Corporation, Kariya, Aichi-Pref. (Japan) | ||
| Filed on Aug. 26, 2005, as Appl. No. 11/212,106. | ||
| Claims priority of application No. 2004-250912 (JP), filed on Aug. 30, 2004. | ||
| Prior Publication US 2006/0043551 A1, Mar. 02, 2006 | ||
| Int. Cl. H01L 23/10 (2006.01) | ||
| U.S. Cl. 257—706 [257/E23.097; 438/122; 438/125] | 42 Claims |
| 27. A unit for dissipating heat from a heat-generating electric component included in electronic components mounted on a circuit
board, the unit comprising:
a casing in which the circuit board is housed;
a heat dissipating member which is thermally conductive, made of a polymeric material having fluidity, and is placed to receive
heat generated from a heat-generating electronic component on the circuit board and to dissipate the received heat via the
casing, wherein the heat dissipating member has two surfaces, one of which is in direct contact with the heat-generating element
or the circuit board; and
a shift preventing member which prevents the heat dissipating member from being physically shifted to the casing by using
a bonding force generated by chemical bonding involving the heat dissipating member.
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