US 7,586,060 B2
Protective sheet for laser processing and manufacturing method of laser processed parts
Masakatsu Urairi, Ibaraki (Japan); Atsushi Hino, Ibaraki (Japan); Naoyuki Matsuo, Ibaraki (Japan); Tomokazu Takahashi, Ibaraki (Japan); Takeshi Matsumura, Ibaraki (Japan); and Syouji Yamamoto, Ibaraki (Japan)
Assigned to Nitto Denko Corporation, Osaka (Japan)
Appl. No. 10/584,825
PCT Filed Nov. 02, 2004, PCT No. PCT/JP2004/016268
§ 371(c)(1), (2), (4) Date Jun. 26, 2006,
PCT Pub. No. WO2005/063435, PCT Pub. Date Jul. 14, 2005.
Claims priority of application No. 2003-430451 (JP), filed on Dec. 25, 2003; application No. 2003-430463 (JP), filed on Dec. 25, 2003; application No. 2004-099896 (JP), filed on Mar. 30, 2004; application No. 2004-100112 (JP), filed on Mar. 30, 2004; application No. 2004-100127 (JP), filed on Mar. 30, 2004; application No. 2004-100141 (JP), filed on Mar. 30, 2004; application No. 2004-100199 (JP), filed on Mar. 30, 2004; and application No. 2004-100281 (JP), filed on Mar. 30, 2004.
Prior Publication US 2007/0181543 A1, Aug. 09, 2007
Int. Cl. B23K 26/38 (2006.01)
U.S. Cl. 219—121.71  [219/121.72] 16 Claims
OG exemplary drawing
 
1. A manufacturing method of laser processed parts by using a protective sheet for laser processing having at least an adhesive layer on a base material, with the density of the base material of 1.1 g/cm3 or more, comprising a step of adhering an adhesive layer of the protective sheet for laser processing to the incident side of laser beam of a workpiece, a step of processing the protective sheet for laser processing and workpiece by irradiating with laser beam, and a step of peeling off the protective sheet for laser processing from the workpiece after processing,
wherein said base material comprises a base polymer and a filler, said filler being selected from the group consisting of a colorant, a pigment, a dye, gold, copper, platinum, silver, fine metal particles, metal colloids, carbon particles, and inorganic particles,
wherein said filler is 2-20 parts by weight per 100 parts of the base polymer, and
wherein the workpiece is any one of sheet material, circuit board, semiconductor wafer, metal substrate, semiconductor laser light emitting or photo detecting element board, MEMS board, and semiconductor package.