US 7,585,798 B2
	Lead-free glass material for use in sealing and, sealed article and method for sealing using the same
Masahiro Yoshida, Kagoshima (Japan); Yasuo Hatate, Kagoshima (Japan); Tsugumitsu Sarata, Kagoshima (Japan); Yoshimitsu Uemura, Kagoshima (Japan); and Tomoyuki Honda, Kagoshima (Japan)
Assigned to Yamato Electronic Co., Ltd., (Japan)
Filed on Jul. 08, 2005, as Appl. No. 11/178,101.
Application 11/178101 is a continuation of application No. PCT/JP03/08174, filed on Jun. 27, 2003.
Prior Publication US 2006/0003883 A1, Jan. 05, 2006
Int. Cl. C03C 8/24 (2006.01); C03C 8/14 (2006.01); C03C 8/08 (2006.01); C03C 8/04 (2006.01); C03C 3/16 (2006.01); C03C 3/21 (2006.01)

U.S. Cl. 501—15  [501/17; 501/24; 501/26; 501/45; 501/46]

6 Claims

1. A lead-free glass material for use in sealing comprising a composition including as essential ingredients V2O5 of 40-50% by weight, ZnO of 5-10% by weight, BaO of 20-25% by weight and P2O5 of 21-35% by weight.