US 7,585,385 B2
Plasma processing apparatus, control method thereof and program for performing same
Satoshi Yamazaki, Nirasaki (Japan); and Taira Takase, Nirasaki (Japan)
Assigned to Tokyo Electron Limited, Tokyo (Japan)
Filed on Jul. 08, 2005, as Appl. No. 11/176,375.
Claims priority of provisional application 60/598426, filed on Aug. 04, 2004.
Claims priority of application No. 2004-202082 (JP), filed on Jul. 08, 2004.
Prior Publication US 2006/0005927 A1, Jan. 12, 2006
Int. Cl. C23C 16/00 (2006.01); C23F 1/00 (2006.01); H01L 21/306 (2006.01)
U.S. Cl. 156—345.46  [156/345.24; 156/345.28; 156/345.42; 156/345.49; 118/723 MR; 118/723 MA] 15 Claims
OG exemplary drawing
 
1. A plasma processing apparatus, comprising:
a processing chamber for accommodating therein an object to be processed;
a plurality of bar-shaped magnets rotatably installed standing around the processing chamber;
a rotation driving mechanism for synchronously rotating the bar-shaped magnets;
a rotation detection unit for detecting a rotation of a bar-shaped magnet and clocking times corresponding to the detected rotation and including a trigger sensor;
an abnormal rotation determination unit for determining whether the rotation driving mechanism is abnormal by comparing an interval calculated from the clocked times to a time period; and
a plurality of trigger sensor pins each being joined to an inner peripheral surface of a gear coaxially disposed with one of the plurality of bar-shaped magnets, and where the trigger sensor detects the plurality of trigger sensor pins,
wherein one end portion of each of the plurality of trigger sensor pins is projected upward from the gear.