| US 7,585,341 B2 | ||
| Polishing material comprising diamond clusters | ||
| Noriyuki Kumasaka, Tokyo (Japan); Yuji Horie, Tokyo (Japan); Mitsuru Saito, Tokyo (Japan); and Kazuei Yamaguchi, Tokyo (Japan) | ||
| Assigned to Nihon Micro Coating Co., Ltd., Tokyo (Japan) | ||
| Filed on May 23, 2007, as Appl. No. 11/805,458. | ||
| Application 11/805458 is a continuation of application No. PCT/JP2006/321690, filed on Oct. 31, 2006. | ||
| Claims priority of application No. 2005-315582 (JP), filed on Oct. 31, 2005. | ||
| Prior Publication US 2007/0231245 A1, Oct. 04, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. C09K 3/14 (2006.01); C09G 1/02 (2006.01); C01B 31/06 (2006.01) | ||
| U.S. Cl. 51—307 [438/691; 438/692; 438/693; 423/446; 451/36; 451/63] | 3 Claims |
| 1. A polishing material comprising diamond clusters, each of said clusters being a combination of artificial diamond particles
having primary particle diameters of 20 nm or less and impurities that are attached around said diamond particles;
density of non-diamond carbon contained in said impurities being 95% or more and 99% or less; and
density of chlorine contained in other than non-diamond carbon in said impurities being 0.5% or more.
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