| US 7,585,204 B2 | ||
| Substrate polishing apparatus | ||
| Yoichi Kobayashi, Kanagawa (Japan); Shunsuke Nakai, Tokyo (Japan); Hitoshi Tsuji, Tokyo (Japan); Yasuo Tsukuda, Osaka (Japan); and Hiroki Yamauchi, Shiga (Japan) | ||
| Assigned to Ebara Corporation, Tokyo (Japan); and Shimadzu Corporation, Kyoto (Japan) | ||
| Filed on Feb. 17, 2009, as Appl. No. 12/372,076. | ||
| Application 12/372076 is a division of application No. 11/806445, filed on May 31, 2007, granted, now 7,510,460. | ||
| Application 11/806445 is a division of application No. 11/169797, filed on Jun. 30, 2005, granted, now 7,241,202, filed on Jul. 10, 2007. | ||
| Application 11/169797 is a division of application No. 10/854250, filed on May 27, 2004, granted, now 6,942,543, filed on Sep. 13, 2005. | ||
| Application 10/854250 is a division of application No. 10/329424, filed on Dec. 27, 2002, granted, now 6,758,723, filed on Jul. 06, 2004. | ||
| Claims priority of application No. 2001-400520 (JP), filed on Dec. 28, 2001. | ||
| Prior Publication US 2009/0191790 A1, Jul. 30, 2009 | ||
| Int. Cl. B24B 49/00 (2006.01) | ||
| U.S. Cl. 451—6 [451/10; 451/11; 451/41; 156/345.13] | 7 Claims |
| 1. A method for polishing a surface of a substrate using a polishing apparatus comprising: a table, on a surface of which
a polishing member is fixed; a substrate support member for pressing the substrate onto a surface of the polishing member;
an optical system for irradiating a surface of the substrate to be polished with a light of irradiation through a through-hole
disposed in the polishing member and for receiving a reflected light reflected from the surface of the substrate, and a monitoring
device for monitoring a status of polishing of the substrate,
the method comprising the steps of: feeding a translucent liquid into the through-hole disposed in the polishing member;irradiating the surface of the substrate to be polished with the light of irradiation through the through-hole;receiving the reflected light reflected from the surface of the substrate to be polished; andmonitoring a status of a film thickness of a thin film on the surface of the substrate to be polished on the basis of an analysis
of the reflected light,
wherein the translucent liquid in the through-hole has a perpendicular flow roughly perpendicular to the surface of the substrate
to be polished, the light of irradiation reaches the surface of the substrate through the perpendicular flow of the translucent
liquid, and the reflected light reaches a light receiving part of the optical system through the perpendicular flow of the
translucent liquid.
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