| US 7,579,275 B2 | ||
| Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device | ||
| Hiroshi Nakano, Hitachi (Japan); Takeyuki Itabashi, Hitachi (Japan); and Haruo Akahoshi, Hitachi (Japan) | ||
| Assigned to Hitachi, Ltd., Tokyo (Japan) | ||
| Filed on Sep. 25, 2002, as Appl. No. 10/253,480. | ||
| Claims priority of application No. 2001-327875 (JP), filed on Oct. 25, 2001. | ||
| Prior Publication US 2003/0079683 A1, May 01, 2003 | ||
| Int. Cl. H01L 21/44 (2006.01); B01J 19/12 (2006.01); G01N 27/26 (2006.01); B05C 3/00 (2006.01) | ||
| U.S. Cl. 438—678 [204/193; 204/406; 118/400] | 7 Claims |
| 1. An electric plating apparatus comprising:
a plating vessel;
an anode electrode;
a cathode electrode; and
a preliminary electrolytic electrode disposed in the plating vessel;
wherein the preliminary electrolytic electrode is electrically connected in series with the anode electrode before the cathode
electrode comes in contact with a plating solution that is introduced to the plating vessel, and
wherein the preliminary electrolytic electrode is electrically connected in parallel with the cathode electrode after the
plating solution comes in contact with said cathode electrode to form said cathode electrode as a plated body.
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