| US 7,579,260 B2 | ||
| Method of dividing an adhesive film bonded to a wafer | ||
| Masaru Nakamura, Tokyo (Japan) | ||
| Assigned to Disco Corporation, Tokyo (Japan) | ||
| Filed on Apr. 16, 2007, as Appl. No. 11/785,167. | ||
| Claims priority of application No. 2006-120354 (JP), filed on Apr. 25, 2006. | ||
| Prior Publication US 2007/0249145 A1, Oct. 25, 2007 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—464 [438/463; 438/462; 438/460; 438/928; 438/113; 438/110; 438/114; 438/118; 438/458; 257/723; 257/783] | 5 Claims |
| 1. A method of dividing an adhesive film for die bonding which is bonded to a rear surface of a wafer having devices in a
plurality of areas sectioned by dividing lines formed in a lattice pattern on a front surface of the wafer, said method of
dividing the adhesive film into pieces corresponding to the devices, and comprising the steps of:
putting the adhesive film side of the wafer on a front surface of a dicing tape mounted on an annular frame;
cutting through the wafer from the front surface into the adhesive film so as to separate the wafer into devices along the
dividing lines and so as to cut the adhesive film only incompletely such that an uncut portion of the film is caused to remain;
and
expanding the dicing tape after the cutting step to divide the adhesive film into pieces corresponding to the devices.
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