US 7,572,661 B2
Method for manufacturing a micromechanical sensor element
Hubert Benzel, Pliezhausen (Germany); Stefan Finkbeiner, Gomaringen (Germany); Matthias Illing, Kusterdingen (Germany); Frank Schaefer, Tuebingen (Germany); Simon Armbruster, Gomaringen (Germany); Gerhard Lammel, Tuebingen (Germany); Christoph Schelling, Reutlingen (Germany); and Joerg Brasas, Walddorfhaeslach (Germany)
Assigned to Robert Bosch GmbH, Stuttgart (Germany)
Filed on Sep. 08, 2005, as Appl. No. 11/223,637.
Claims priority of application No. 10 2004 043 357 (DE), filed on Sep. 08, 2004.
Prior Publication US 2006/0063293 A1, Mar. 23, 2006
Int. Cl. H01L 21/00 (2006.01)
U.S. Cl. 438—53  [257/419; 257/E21.216; 216/99] 21 Claims
OG exemplary drawing
 
1. A method for manufacturing a micromechanical sensor element having a hollow space and a membrane, comprising:
applying a structured etch mask having a plurality of holes on a semiconductor substrate;
creating depressions beneath the holes via an etch process;
forming, via anodization, an area rendered porous beneath at least one of the depressions in the semiconductor substrate and a lattice-like structure, made of a substrate material that has not been rendered porous, on a surface of the semiconductor substrate between the depressions;
removing the etch mask; and
creating the hollow space out of the area rendered porous and the membrane above the hollow space out of the lattice-like structure via one of a temperature treatment and an electro polishing of the semiconductor substrate;
wherein the semiconductor substrate has the same doping concentration in both the area rendered porous and the lattice-like structure, and
wherein a formation of the area rendered porous beneath and a formation of the lattice-like structure are doping-independent.