| US 7,572,515 B2 | ||
| Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof | ||
| Murali Sethumadhavan, Shrewsbury, Mass. (US); Vincent R. Landi, Phoenix, Ariz. (US); and Luis D. Borges, Pomfret Center, Conn. (US) | ||
| Assigned to World Properties, Inc., Lincolnwood, Ill. (US) | ||
| Filed on Jan. 19, 2005, as Appl. No. 11/39,378. | ||
| Claims priority of provisional application 60/537944, filed on Jan. 20, 2004. | ||
| Prior Publication US 2005/0173780 A1, Aug. 11, 2005 | ||
| Int. Cl. B32B 25/20 (2006.01) | ||
| U.S. Cl. 428—447 [428/450; 525/474; 525/477; 525/476; 525/479] | 26 Claims |
| 1. A circuit material for the formation of circuits or multi-layer circuits, the circuit material comprising
a first conductive layer;
a layer of a dielectric material disposed on the first conductive layer, wherein the dielectric material comprises the reaction
product of a polyhedral silsesquioxane and a dielectric polymer, wherein the dielectric polymer is an alkenyl-terminated polydialkylsiloxane,
an alkenyl-terminated polydiarylsiloxane, an alkenyl-terminated polyalkylarylsiloxane, or an alkenyl-terminated copoly(dialkylsiloxane/diarylsiloxane);
and
a second conductive layer disposed on the layer of dielectric material on a side opposite the first conductive layer.
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