| US 7,551,446 B2 | ||
| Thermal management device attachment | ||
| William Handley, Chandler, Ariz. (US); Edoardo Campini, Mesa, Ariz. (US); and Javier Leija, Chandler, Ariz. (US) | ||
| Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
| Filed on Nov. 03, 2005, as Appl. No. 11/265,859. | ||
| Prior Publication US 2007/0096298 A1, May 03, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01); H01L 23/36 (2006.01) | ||
| U.S. Cl. 361—719 [361/707; 361/709; 165/80.3; 165/185] | 6 Claims |
| 1. A thermal management device attachment apparatus comprising:
a support member comprising:
a circuit board mounting portion configured to be mounted to a circuit board, said circuit board mounting portion includes
a plurality of mounting holes each having a width less than 1.5 mm;
a thermal management device mounting portion configured to be mounted to a thermal management device, said thermal management
device comprising mounting extensions extending from corners of said support member, said mounting extensions including mounting
holes for receiving thermal management device fasteners; and
a side portion extending from said circuit board mounting portion to said thermal management device mounting portion, said
side portion being configured to extend around at least a portion of a heat generating component disposed on said circuit
board, and wherein said circuit board mounting portion extends inwardly from said side portion toward said heat generating
component, and wherein said thermal management device mounting portion extends outwardly from said side portion away from
said heat generating component;
a plurality of fasteners configured to extend through said plurality of mounting holes in said circuit board mounting portion
and into said circuit board, said fasteners having a thickness less than 1.5 mm, wherein said side portion of said support
member includes four sides that form a shape corresponding to a shape of said heat generating component.
|