| US 7,551,141 B1 | ||
| RFID strap capacitively coupled and method of making same | ||
| Mark A. Hadley, Newark, Calif. (US); Curt L. Carrender, Morgan Hill, Calif. (US); and John Stephen Smith, San Jose, Calif. (US) | ||
| Assigned to Alien Technology Corporation, Morgan Hill, Calif. (US) | ||
| Filed on Nov. 07, 2005, as Appl. No. 11/269,305. | ||
| Application 11/269305 is a continuation in part of application No. 11/159550, filed on Jun. 22, 2005. | ||
| Claims priority of provisional application 60/626241, filed on Nov. 08, 2004. | ||
| Int. Cl. H01Q 1/38 (2006.01); H01Q 1/40 (2006.01) | ||
| U.S. Cl. 343—700MS [343/873] | 27 Claims |
| 1. A device comprising:
an antenna assembly comprising a first substrate and antenna elements;
a strap assembly overlaying and affixed to said antenna assembly, the strap assembly comprising a second substrate having
an integrated circuit embedded within the second substrate, wherein the integrated circuit comprises one or more contact pads,
and wherein said integrated circuit being substantially flush with a surface of the second substrate, and interconnections
are connected to the integrated circuit through the one or more contact pads, said interconnections being formed on said surface
of said second substrate, and wherein the interconnections are substantially larger than the one or more contact pads; and
a non-conductive layer disposed between antenna elements and said interconnections to allow said antenna elements to capacitively
couple to said interconnections,
wherein said antenna assembly and said strap assembly are affixed to one another with said surface of said second substrate
facing said antenna elements and said antenna elements capacitively coupled to said integrated circuit without direct physical
contact between the antenna elements and the integrated circuit.
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