a semiconductor substrate having a back surface, serving as a light-incident surface, and a front surface, opposing the back surface and being provided with a charge reading part constituted by a charge coupled device that detects light propagating from the back surface, said semiconductor substrate having a structure such that the thickness of the region at which said charge reading part is disposed is made thinner than the thickness of the remaining region;

a package having a cavity that houses said semiconductor substrate and that is fixed with said semiconductor substrate while the front surface of said semiconductor substrate faces a bottom part of said cavity;

a fiber optic plate having a light outgoing end surface joined to the back surface of said semiconductor substrate while at least a part thereof is housed in said cavity of said package;

a cover covering an upper opening of said cavity of said package, said cover having a guiding opening for inserting at least the part of said fiber optic plate into said cavity; and

electrical wirings for taking out charge signals output from said charge reading part to the exterior of said package, said electrical wirings including substrate-side electrodes disposed on the front surface of said semiconductor substrate, package-side wirings disposed on the bottom surface of said cavity and being electrically connected to said substrate-side electrodes via bumps disposed on said substrate-side electrodes, and package-side electrodes disposed on an inner wall of said cavity and being electrically connected to said package-side wirings by bonding wires.