| US 7,550,055 B2 | ||
| Elastomer bonding of large area sputtering target | ||
| Hienminh H. Le, San Jose, Calif. (US); and Akihiro Hosokawa, Cupertino, Calif. (US) | ||
| Assigned to Applied Materials, Inc., Santa Clara, Calif. (US) | ||
| Filed on Sep. 12, 2005, as Appl. No. 11/224,221. | ||
| Claims priority of provisional application 60/686095, filed on May 31, 2005. | ||
| Prior Publication US 2006/0266643 A1, Nov. 30, 2006 | ||
| Int. Cl. B32B 15/00 (2006.01) | ||
| U.S. Cl. 156—276 [156/381; 156/382; 156/385; 156/386; 156/583.1; 204/298.12; 204/298.14] | 29 Claims |
| 1. A method of bonding at least one sputtering target tile to a backing plate, comprising:
providing an elastomeric adhesive layer between the at least one sputtering target tile and the backing plate;
providing at least one metal mesh within the elastomeric adhesive layer, wherein at least a portion of the at least one metal
mesh contacts both the at least one sputtering target tile and the backing plate, and the at least a portion of the at least
one metal mesh is made of metal wire with a diameter greater than 0.5 mm; and
curing the elastomeric adhesive layer between the at least one sputtering target tile and the backing plate by passing heated
water through at least one heating channel in the backing plate.
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