| US 7,549,914 B2 | ||
| Polishing system | ||
| Andreas C. Ladjias, Kinnelon, N.J. (US) | ||
| Assigned to Diamex International Corporation, | ||
| Filed on Sep. 28, 2005, as Appl. No. 11/238,174. | ||
| Prior Publication US 2007/0072526 A1, Mar. 29, 2007 | ||
| Int. Cl. B24D 11/00 (2006.01) | ||
| U.S. Cl. 451—533 [451/550] | 19 Claims |
| 1. A polishing system comprising:
an uppermost polishing pad comprising a polishing surface defining the top of the polishing system;
an adhesive laminate below the uppermost polishing pad, the adhesive laminate including a layer formed of an impermeable polymeric
film, the adhesive laminate further including an adhesive material beneath the layer formed of an impermeable polymeric film;
and
wherein one or more openings are defined by the lower surface of the impermeable polymeric film adjacent to the adhesive material
for trapping, dissipating, or venting gas released from the adhesive.
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