US 7,549,220 B2
Method for making a multilayer circuit
E. Clifford Roseen, Jr., Warwick, R.I. (US); Scott D. Kennedy, Canterbury, Conn. (US); Doris I. Hand, Holland, Mass. (US); Michael S. White, Pomfret Center, Conn. (US); and Allen F. Horn, III, Pomfret Center, Conn. (US)
Assigned to World Properties, Inc., Lincolnwood, Ill. (US)
Filed on Dec. 17, 2003, as Appl. No. 10/740,382.
Prior Publication US 2005/0132566 A1, Jun. 23, 2005
Int. Cl. H05K 3/36 (2006.01)
U.S. Cl. 29—830  [29/829; 29/831; 29/846; 156/272.2] 18 Claims
OG exemplary drawing
 
1. A method for the manufacture of a multilayer circuit, comprising
laminating a stack comprising a first circuit, a second circuit, and a bond ply layer disposed therebetween, the bond ply comprising a liquid crystalline polymer layer having a glass transition temperature and a first crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement; and
subsequent to said laminating, treating the laminated stack at a temperature between the glass transition temperature and the first melting point effective to raise the first melting point to a second crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, wherein the second melting point is at least about 10° C. greater than the first melting point.