| US 7,514,783 B2 | ||
| Semiconductor module | ||
| Kazuo Shimokawa, Yokohama (Japan); Takashi Koyanagawa, Yokohama (Japan); Masako Ooishi, Yokohama (Japan); Tatsuya Yamada, Yokohama (Japan); Osamu Usuda, Tatsuno (Japan); Yoshiki Endo, Hyogo (Japan); Taiki Miura, Hyogo (Japan); Masaki Toyoshima, Himeji (Japan); Ichiro Omura, Yokohama (Japan); Akio Nakagawa, Fujisawa (Japan); Kenichi Matsushita, Tokyo (Japan); Yusuke Kawaguchi, Kanagawa (Japan); Haruki Arai, Yokohma (Japan); Hiroshi Takei, Kawasaki (Japan); Tomohiro Kawano, Zama (Japan); Noriaki Yoshikawa, Yokohma (Japan); Morio Takahashi, Fukaya (Japan); Yasuhito Saito, Yokohma (Japan); and Masahiro Urase, Himeji (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Aug. 31, 2005, as Appl. No. 11/214,730. | ||
| Claims priority of application No. 2004-253276 (JP), filed on Aug. 31, 2004. | ||
| Prior Publication US 2006/0055432 A1, Mar. 16, 2006 | ||
| Int. Cl. H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—706 [257/707] | 13 Claims |
| 1. A semiconductor module, comprising:
a mounting board formed to be a rectangle in shape with four sides;
a plurality of power switching device chips each having an upper surface and a lower surface and mounted on said mounting
board by flip-chip bonding with said upper surface faced toward said mounting board;
a drive IC chip mounted on said mounting board by flip-chip bonding and operation to drive gates of transistors formed in
said plurality of power switching device chips;
a plurality of heat sink members located respectively on said lower surfaces of said plurality of power switching device chips;
a resinous member provided to seal said plurality of power switching device chips and said drive IC chip in a single package;
and
a power source terminal and a ground terminal of a circuit configured by said plurality of power switching device chips,
wherein said power source terminal is located at one of two adjacent perpendicular sides of said rectangle, and said ground
terminal is located at the other adjacent perpendicular side; and
wherein said heat sink member services as a wire that connects said power switching device and said mounting board; and
further comprising a decoupling condenser connected between said power source terminal and said ground terminal.
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